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datashee t product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/26 tsz02201-0y1y0f300120-1-2 ? 2013 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 tsz22111 ? 14 ? 001 www.rohm.co.jp 4-wire resistive touch screen controller BU21029GUL key specifications power supply voltage temperature range standby current sleep current operating current coordinate resolution 1.65[v] 3.60[v] -20[ ] 85[ ] 1.0[ua] (max.) 100[ua] (typ.) 0.8[ma] (typ.) 12bit general description unlike most resistive touch screen controllers, the BU21029GUL 4-wire resistive touch-screen controller can generate data that enables dual touch detection. the host processor can use this data to detect single and dual point coordinates. features single and dual touch detection for standard 4-wire resistive touch screens i2c-like interface for interfacing with the host processor 12-bit resolution single 1.65v to 3.60v supply power on reset auto power down control built-in clock oscillator circuit package vcsp50l2 2.00 mm x 2.00 mm x 0.55(max) mm applications equipment with built-in user interface for 4-wire resistive touch screen portable information equipment like smart phones, tablets, and pdas audio-visual equipment like digital still cameras, digital video cameras, and portable tvs pcs or peripheral equipment like laptops, touch screen monitors, and printers typical application circuit host ( gpio port ) vdd host i/f yn adc (10bit) panel i/f yp xn xp aux rstb scl sda int ad0 ad1 clock generator osc regulator BU21029GUL host io vdd 4-wire resistive touch screen y+ y- x- x+ 0.1uf 1.0uf 1.0uf 10ohm 10ohm 10ohm 10ohm 1.0nf 1.0nf 1.0nf 1.0nf option(*1) option(*2) option(*1) for noise protection option(*2) please connect to vdd, when use as slave address = "41h". option(*3) for esd protection. tvs diode option(*3)
2/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 pin configuration pin description pin no pin name i/o description equivalent circuit a1 yp i/o yp channel input d a2 xn i/o xn channel input d a3 yn i/o yn channel input d a4 ad0 i slave address input bit0 a b1 xp i/o xp channel input d b2 pgnd - ground for touch screen drivers - b3 ad1 i test input(*1) a b4 sda i/o serial data(*2) c c1 pvdd - power supply for touch screen drivers. - c2 aux i auxiliary channel input d c3 rstb i system reset(*3) a c4 scl i serial clock(*2) c d1 vref - regulator output for control logic.(*4) - d2 gnd - ground - d3 vdd - power supply - d4 int o interrupt output. pin polarity with active low. b (*1) connect ad1 to gnd. (*2) scl and sda need a pull-up resistor greater than 2.2k ? . (*3) connect rstb to vdd if it will not be controlled. (*4) bypass vref, dvdd_in, dvdd_out to gnd with a 1.0uf capacitor and do not connect to the supply. equivalent circuit pad pad pad pad figure a. figure b. figure c. figure d. 1 2 3 4 a b c d top view vref gnd vdd int pvdd aux rstb scl xp pgnd ad1 sda yp xn yn ad0
3/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 block diagram vdd xp int pgnd pvdd vref ldo xn yp yn ldo m u x aux sar adc control logic & 2 wire serial i/f touch screen drivers & i/f osc sda scl ad0 ad1 rstb por gnd penirq overview BU21029GUL is a controller for 4-wire resistive touch screens. it has built-in 12-bit sar a/d converter, clock oscillator, power on reset circuit, and ldo regulator for internal blocks and operates with 1.65-3.60v single power supply. aside from being able to detect single point coordinates and touch pressure like existing 4-wire resistive touch screen controllers can, it can also detect dual coordinates by generating data based on the prearranged touch screen parameters. communication between BU21029GUL controller and the host processor uses 2-wire serial interface. the BU21029GUL, being the i2c slave device, is controlled by the host processor by writing to its registers. this way, the host processor sets whether the touch screen controller operates under command control mode or under automatic control mode. in automatic control mode, the host processor reads the touch data saved by the controller in its internal registers at any time. preprocess a/d conversion is continuously done for several times in one driving time. data is median average processed; meaning data is sorted and calculation that takes the average from the center of the sorted data is performed. interrupt control the BU21029GUL sends an interrupt signal to the host processor through int, an active-low pin, whenever it detects touch on the screen. in automatic control mode, this happens after the scan of the first touch is completed. 2-point detection function the 2-point detection function of BU21029GUL can be used by calibrating the circuit for 2-point detection based on the inherent panel perimeters (registers 0x3, 0x4). since the characteristics of each touch panel differ significantly, it is necessary for the host processor to execute the calibration of parameters to match the 2-point detection circuit of BU21029GUL with every touch panel. power control after a conversion function has been completed, the BU21029GUL automatically powers down in order to reduce current consumption. in automatic control mode, scanning restarts automatically from power down when the touch screen is operated. power on reset BU21029GUL has built-in power-on-reset circuit. if the host processor will not be used to control rstb pin, rstb pin can be shorted to vdd. this way, the registers of BU21029GUL initialize upon power-on.
4/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 absolute maximum ratings (*1) ambient temperature reduces the permissible loss by 7.50mw/c if above 25c celsius. operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions electrical characteristics (ta=25 , vdd=pvdd=3.00v, gnd=0.00v, unless otherwise noted) rating parameter symbol min typ max unit conditions low-level input voltage v il gnd-0.3 - vdd*0.2 v ad0,ad1,sda,scl and rstb high-level input voltage v ih vdd*0.8 - vdd+0.3 v ad0,ad1,sda,scl and rstb low-level output voltage1 v ol1 - - gnd+0.4 v sda( il=5ma ),int( il=3ma ), vddR 2.0v low-level output voltage2 v ol2 - - vdd*0.2 v sda (il=5ma) ,int (il=3ma) , vdd < 2.0v high-level output voltage1 v oh1 vdd-0.4 - - v int,il=-3ma vdd R 2.0v high-level output voltage2 v oh2 vdd*0.8 - - v int,il=-3ma vdd < 2.0v standby current i st - - 1.0 ua rstb=l sleep current i slp - 100 200 ua rstb=h active current i act - 0.8 2.0 ma no load resolution a d 12 bit differential non-linearity error d nl -3 - +3 lsb integrate non-linearity error i nl -5 - +5 lsb switch on-resistance r on 0.5 5.0 20.0 ? xp,xn,yp and yn parameter symbol rating unit conditions power supply voltage v dd -0.3 to 4.5 v power supply voltage for touch screen pv dd -0.3 to 4.5 v digital input voltage v in1 -0.3 to vdd+0.3 v ad0,ad1,sda, scl and rstb aux input voltage v in2 gnd-0.3 to 2.5 v aux voltage input to touch screen interface v in3 gnd-0.3 to 2.5 v xp,yp,xn and yn package power dissipation p d 0.75 w (*1) storage temperature range t stg -50 to 125 rating parameter symbol min typ max unit conditions power supply voltage v dd 1.65 3.00 3.60 v power supply voltage for touch screen pv dd 1.65 - vdd v vddR pvdd operating temperature t opr -20 25 85
5/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 host interface ac timing the slave address for 2-wire serial interface is selectable from ?40h? or ?41h? by ?ad0? input. ad0 = ?l? : slave address = 40h ad0 = ?h? : slave address = 41h 2-wire serial i/f ac timing characteristics (ta=25 , vdd=pvdd=3.00v, gnd=0.00v, unless otherwise noted) rating parameter symbol min. typ. max. unit condition scl clock frequency f scl 0 - 400 khz hold time for (repeated) start condition t hd_sta 0.6 - - us low period of scl t low 1.3 - - us high period of scl t high 0.6 - - us setup time for repeated start condition t su_sta 0.6 - - us data hold time t hd_dat 0 - 0.9 us data setup time t su_dat 0.1 - - us rise time for both scl and sda t r 20 - 300 ns fall time for both scl and sda t f 20 - 300 ns setup time for stop condition t su_sto 0.6 - - us bus free time between a stop and start condition t buf 1.3 - - us
6/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 host interface specification the BU21029GUL controller operates as an i2c slave device. at the start of the communication, it receives an address byte transmitted by the host processor and then then sends back an acknowledgement byte. the host processor can transmit a command to execute conversion or to access registers only after receiving the acknowledgement for the address byte. communication ends when BU21029GUL receives a stop command. address byte on the address byte, the slave address for 2-wire interface is written on the upper 7 bits and the read/write bit is written on the last bit. the upper six bits of the slave address are fixed to ?100000? while the last bit is determined by the ?ad0? input. table 1. serial interface slave address byte msb d7 d6 d5 d4 d3 d2 d1 lsb d0 100000a0r/w bit d1: a0 slave address bit0 (ad0) bit d0: r/w 1=read (reading data) 0=write (writing data) command byte the operation of BU21029GUL is dictated by the command byte. the host processor sets cid (d7) to 1 for conversion function or to 0 for register access. table 2. serial interface command byte 1(cid=1) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 1cmskpdmstp cf bit d7: command byte id 1= command byte 1(starts the conversion function determined by cf (bit d6-d3) bits d6-d4: cf conversion function is selected as detailed below. table 3. BU21029GUL conversion function list cf description 0x0 touch screen scan function: x, y, z1 and z2 coordinates are converted. 0x1 nop 0x2 auxiliary input is converted. 0x3 clipping value is changed. 0x4 free scan function: status of driver and input of a/d is assigned by the host. 0x5 calibration: parameters for dual touch detection are calibrated. 0x6 nop 0x7 nop 0x8 x+, x- driver status 0x9 y+, y- driver status 0xa y+, x- driver status 0xb nop 0xc touch screen scan function: x coordinate is converted. 0xd touch screen scan function: y coordinate isconverted. 0xe touch screen scan function: z1 and z2 coordinates are converted. 0xf reserved
7/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 cf= 0000 : automatic scan this makes BU21029GUL periodically and automatically scan the screen and convert data upon detecting touch. when the device cannot detect touch, it stops and stays in power down state until it detects the next pen-down. the order of scan process is z1, z2, x and y. cf= 0001, 0110, 0111, 1011 no operation. (?pdm? and ?stp? is valid.) cf = 0010 this converts the voltage impressed to aux. after the conversion has been completed, the device is powered down according to the pdm setting. cf= 0100 : free scan mode in free scan mode, the driver state (x+, x-, y+, y-) and conversion input (x+, x-, y+, y-, aux) can be selected through register settings. cf= 0101 : calibration this calibrates the parameters for dual touch detection. to activate the dual touch function, setting of cf to 0101 and execution of the calibration command should be done after power-on. cf= 1000, 1001, 1010: drivers status control this activates the analog circuit and panel driver corresponding to each command. BU21029GUL remains in this state until it receives another scan instruction or until "stp" is set. cf= 1100, 1101, 1110: manual scan this converts coordinates that correspond to each command. BU21029GUL goes to power-down state after a complete conversion if "pdm" is set to "0". otherwise, it stays at power-on state. cf =0011, 1111 reserved. bit d2 cmsk 0=executes convert function. 1=reads the convert result bit d1 pdm power down control 0= powers down the device after converter function stops 1= keeps power on after converter function stops bit d0 stp 1= aborts currently running conversion and changes the state to power-down (stp is automatically set to ?0?.)
8/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 4. serial interface command byte 0(cid=0) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 0 page swrst stp addr[3:0] bit d7: command byte id 0=reads/writes on data register addresses specified by addr (bit d6-d3). bits d6-d3: addr d2: page register addresses that ?addr? and ?page? can access are listed below. table 5. BU21029GUL register map pag e a ddr ini 7 6 5 4 3 2 1 0 0 0 x0 0x2 0 rsv0 rsv0 calib intrm rsv0 rsv0 rsv0 rsv0 0x10xa6mav - 0x2 0x04 0x3 0x10 0x4 0x10 0x5 0x10 0x6 0x00 0x7 0x00 0x8 0x00 - - - - 0x9 0x0f - - - 0xa 0x0f - - - 0xb 0x72 rm8 stretch pu90k dual 0xc 0x00 - - 0xd 0x00 test auto pdm - busy active calib _ done touch 0xe 0x02 0xf 0x29 1 0x0 0x00 sw_yp_ pow sw_yp_ gnd sw _yn_ pow sw_yn_ gn d sw_xp_ pow sw_ xp_ gnd sw_xn_ pow sw_xn_ gnd 0x1 0x0 0 rsv0 rsv0 rsv0 sw _ au x sw _ ypm sw _ ynm sw _ xpm sw _ xnm 0x2-0x4 - 0x5 0x03 rsv0 dprm rsv0 rsv0 rsv0 rsv0 rsv1 rsv1 0x6-0x f - rsv0 ave smpl intvl_time time_st_ad c rsv0 evr_ x evr_y evr_xy rsv0 reserved pimir_x pimir_y pidac_ofs pvdd avdd hw_idh hw_idl reserved (*1) rsv0 must be set to 0. (*2) rsv1 must be set to 1 bit d1: swrst 1= initializes all registers, stops all operations, and changes state to power-down (swrst is automatically set ?0?.) bit d0: stp 1= aborts currently running conversion and changes the state to power-down (stp is automatically set to ?0?.)
9/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 write cycle the host first sends an address byte to the BU21029GUL controller. this address byte is composed of the 7-bit slave byte on the upper seven bits and the read/write bit on the lsb. if the controller receives a valid address byte, it issues an acknowledgement. the host processor can transmit a command only after receiving the acknowledgement for the address byte from the controller. the controller then sends back another acknowledgement, allowing the host to continually send write data or issue a stop command. s start condition p stop condition a ack n nack figure 1. write protocol read cycle the read bit is the lsb of the address byte. when read mode is selected, BU21029GUL sends back the data byte followed by an acknowledgement to the host. the data sent back is either the conversion result or the register value, depending on the last command byte received by BU21029GUL. the host needs to resend the conversion command with setting "cmsk=1" if it has read the register value before reading the conversion result. BU21029GUL sends the next data byte after it has received an acknowledgement from the host for the previous data byte. upon receiving the last data byte, the host finishes read access by issuing a start (or stop) commands followed by nack (not acknowledged) command. s start condition p stop condition a ack n nack figure 2. read protocol scl stretch if the host reads the conversion result while conversion is ongoing, BU21029GUL notifies it through the scl_stretch function. (*1) scl_strech is released when conversion function is finished. figure 3. scl stretch timing
10/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 power supply and reset timing specification when pin rstb is low, BU21029GUL is in standby mode and the host cannot communicate with it. once pin rstb is set high, BU21029GUL will go to idle state after the time define by tdelay has passed and will be able to communicate with the host processor again. pin rstb can be connected to the power supply through the power-on-reset circuit. vdd pvdd rstb 0v trise twait typ. 3.0v 0v toff tdelay l(disable) h(enable) l(disable) enable (internal signal) vdd*0.2 typ. 3.0v power-on-reset ac timing characteristics (ta=25 , vdd=pvdd=3.00v, gnd=0.00v, unless otherwise noted) rating parameter symbol min typ max unit condition vdd rise time trise 0.01 - 10 ms rstb delay time tdelay 0 - - ms enable delay time twait - - 1 ms vref, dvdd_in, dvdd_out, cload=1.0uf rstb time toff 1 - 30 us vref, dvdd_in, dvdd_out, cload=1.0uf
11/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 specification of touch detection BU21029GUL executes its touch detection function by outputting an interrupt signal at pin int once it is able to detect touch. the circuit diagram of the touch detection function is shown on the following figure. xp yp yn pgnd 50k 90k pvdd pu90k (register) control logic int short when touch screen is touched high when xp or yp dirvers on gnd on figure 4. touch detection circuit when the touch panel is connected to the panel interface terminals (xp, xn, yp, yn), pin xp is connected to pvdd through an internal pull-up resistor inside the ic and pin yn is connected to pgnd. during a no-touch state, BU21029GUL will be on standby. during this time, int outputs "h" through an internal pull-up resistor. since pins xp and yn are connected to the touch screen through contact resistance, the resistance ratio of the internal pull-up resistance and the touch screen resistance is able to detect the voltage drop at pin xp whenever the screen is touched. this results to an "l" output at int. when touch is detected and pins xp and yp is put to drive state by each scanning operation, the internal pull-up resistance is disconnected from pin xp and the output of pin int is held at "l".
12/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 control flow chart BU21029GUL has two operation modes, the command mode, wherein the device operates under the control of the host processor, and auto mode, wherein the device operates by automatic control. in order to use two-point detection, it is necessary to calibrate the circuit for this function by setting the correct state of registers for panel perimeters (register addr.0x3, 0x4). calibration is performed by transmitting the command cf=0101 from the host processor. take note that each register should be initialized after power on. moreover, for two-point detection, the interrupt signal from the ic should be enabled after performing parameter calibration. table 6. the BU21029GUL power-on sequence step state operation 1 power-on power supply is turned on and reset is issued disable (mask) interruption of the BU21029GUL is set. 2 initialization 1 for 2 points detecition only after the waiting time from the issuance of reset, each register of BU21029GUL is initialized by the host processor via the i2c bus. 3 the host processor checks if the scr een is touched though the int pin or the status register of BU21029GUL. this step is repeated until touch is detected. 4 the host processor transmits the calibration command (cf=0101) via the i2c bus. 5 BU21029GUL executes calibration of the two-point detection parameters and sets calib_done status register to 1. 6 the host stays in stand by state until a fixed period of time or until the calib_done bit is turned on. 7 initialization 3 (for auto mode only) for auto mode control, the host processor transmit the scan-xyz command via the i2c bus. for command control mode, this step is skipped. 8n o r m a l (finish) if the host processor receives an interrupt signal from BU21029GUL, it executes the other process. if not, it stays idle until an interrupt signal is detected. initialization 2 for 2 points detecition only figure 5. calibration flow tpon = 710us tdly1 = 1.5us tadc = 18us tdly2 = 1.0us ttime_st_adc = register (addr.0x2) tsmpl = register (addr.0x1) tconv1 = tpon + tdly1 + (ttime_st_adc + (tadc * tsmpl) * 2 + tdly2) tcalib = 1 internal clock (*1) even if the part with dashed lines is not performed, read status does not influence the operation. (*2) except the first one, tpon(s) is always zero. bu21029 host detecting touch int calib (cf=0x5) sample and conversion for x coordinate read status tconv1 sample and conversion for y coordinate calibrate parameters sample and conversion for x coordinate sample and conversion for y coordinate calibrate parameters tconv1 tconv1 tconv1 detecting touch tcalib tcalib
13/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 command mode in command mode, BU21029GUL operates totally under the control of the host processor. in order to take touch data, the host processor needs to control BU21029GUL when there is touch pressure. since it is necessary for the host processor to issue a command in order to get data, the processing of a ho st interface in between the presence of touch pressure becomes more active compared with the auto system. table 7. command method sequence touch screen operation not touched the BU21029GUL is in idle state(power down). the host processor operates the other process or stays in the idle state. the BU21029GUL detects a touch and transmits interrupt signal to the host processor. the host processor detects a disabled interrupt signal from the BU21029GUL. the host processor transmits the command for x data conversion via i2c bus. the BU21029GUL turns on the x drivers and makes the x-axis of the touch screen turn on the powe r . the BU21029GUL converts the x data from the touch screen and transmits via i2c bus. the host processor receives the center data and the 2-point data (total of 4 bytes). if there is no 2-point detection, only the center data (2 bytes) is received. if the host processor needs 2 or more data by filter processing etc., it repeats steps 4~7. the host processor transmit command of y data conversion via i2c bus. after the BU21029GUL turns off the x drivers, it turns on the y drivers and makes the y-axis of the touch screen turn on the power. the BU21029GUL converts the y data from the touch screen ad transmits via i2c bus. the host processor receives the center data, the 2-point data, and ghost data (total of 6 bytes). if there is no 2-point detection, only the center data (2 bytes) is received. if the host processor needs 2 or more data by filter processing etc., it repeats steps 8~11. the host processor transmits the command for z data conversion via i2c bus. after the BU21029GUL turns off the y drivers, it turns on the z drivers(*1) and makes the z-axis of the touch screen turn on the electricity. the BU21029GUL converts the z data from the touch screen ad transmits via i2c bus. the host processor receives the z data (total of 4 bytes). if the host processor needs 2 or more data by filter processing etc., it repeats steps 12~15. the host processor calculates all the data and coverts them into touch coordinates. the host processor checks the touch pressure from the int pin or the status register of the bu 21029gul. steps 4 16 are repeated when there is touch pressure. not touched return to step 1. touched (*1) z driver: yp=vdd, xn=gnd state (*2) refer to the dual coordinate conversion in p. 17 for the conversion of coordinates from read data.
14/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 figure 6. touch screen scan flow 1 (x and y scan) figure 7. touch screen scan flow 2 (z1 and z2 scan) tpon = 710us tdly1 = 1.5us tadc = 18us tdly2 = 1.0us ttime_st_adc = register (addr.0x2) tsmpl = register (addr.0x1) tconv1 = tpon + tdly1 + (ttime_st_adc + (tadc * tsmpl) * 2 + tdly2) tconv2 = tpon + tdly1 + ttime_st_adc + (tadc * tsmpl) + tdly2 tconv3 = tdly1 + (tadc * tsmpl) + tdly2 (*1) time is calculated with the oscillating frequency of the internal osc at 8mhz. (*2) in case pdm=1, tpon(s) is set to zero except for the first one. (*3) the dashed part is required only when apply time set for a panel is more than time_st_adc. bu21029 host detecting touch int turn on x+ and x- drivers (cf=0x8) scan x (cf=0xc) sample and conversion for x coordinate waiting for scan command read result of scan x detecting touch turn on y+ and y- drivers (cf=0x9) scan y (cf=0xd) read result of scan y sample and conversion for y coordinate wai ting for scan command detecting touch tconv1 tconv1 bu21029 host detecting touch int turn on x+ and y- drivers (cf=0xa) scan z (cf=0xe) sample and conversion for z1 coordinate waiting for scan command read result of scan z1 detecting touch tconv2 read result of scan z2 sample and conversion for z2 coordinate tconv3
15/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 auto mode in auto mode, BU21029GUL automatically takes all detected touch and pressure data. an interrupt signal for the 1st data taken is transmitted after detection of touch pressure has been completed. since BU21029GUL automatically takes data whenever touch pressure is detected, the host processor does not need to control the touch screen. when operating in this mode, there is a possibility for touch detection to stop due to touch screen chattering noise, power supply noise, etc. thus, the host processor should periodically refresh BU21029GUL by transmitting the command cf=0000. auto mode of operation starts when scan-xyz (cf=0000) is received from the host processor. the int pin is not concerned with any touch state. it is set to ?h? until the 1st touch data from the start of operation is acquired. table 8. auto method sequence step touch screen operation 1 not touched the BU21029GUL is in idle state(power down). the host processor operates the other process or keeps the idle state. 2 the BU21029GUL detects touch and turns on z drivers(*1). 3 the BU21029GUL converts the z data from the touch screen and saves the result temporarily. 4 after the BU21029GUL turns off the z drivers, it turns on the x drivers and makes the x-axis of the touch screen turn on power. 5 the BU21029GUL converts the x data from the touch scren and saves the result temporarily. 6 after the BU21029GUL turns off the x drivers, it turns on the y drivers and makes the y-axis of the touch screen turn on power. 7 the BU21029GUL converts the y data from the touch scren and saves the result temporarily. 8 the BU21029GUL che cks touch pressure. when touch pressure is detected, all conversion results are copied to the internal registers of the BU21029GUL and interrupt signal is transmitted to the host processor. then the process returns to step 2. when no touch pressure is detected, all conversion result are cancelled and transmission of an 9 the host processor does the mask of the interruption after receiving an interrupt signal. 10 the host processor receives all touch and 2-point data (total of 14 bytes) via i2c bus and converts to them to touch coordinates.(*2) when not detecting 2 points, only touch data (8 bytes) is received. 11 the host processor checks the touch pressure from the int pin or status register of bu 21029gul. it returns to step 10 when there is touch pressure and to step 1 when there is none. touched (*1) z driver: yp=vdd, xn=gnd state (*2) refer to the dual coordinate?s conversion (p. 17) for the conversion of coordinates from read data. (*3) the host processor can refresh at any timing, and recommended timing is in sequence with step 1. figure 8. touch screen scan flow 3 (xyz scan) tpon = 710us tdly1 = 1.5us tadc = 18us tdly2 = 1.0us ttime_st_adc = register (addr.0x2) tintvl = register (addr.0x2) tsmpl = register (addr.0x1) tconv4 = tpon + tdly1 + (ttime_st_adc + (tadc * tsmpl) * 2 + tdly2) * 3 (*1) time is calculated with the oscillating frequency of the internal osc is 8mhz. (*2) in the case of pdm=1, every tpon(s) is zero except for the first one. (*3) the order of taking each touch data, etc. cannot be changed. bu21029 host detecting touch int scan xyz (cf=0x0) sample and conversion tconv4 read result of scan xyz z1 coordinate z2 coordinate x coordinate y coordinate wait (intvl_time) sample and conversion z1 coordinate z2. tintvl
16/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 dual coordinates conversion the touch position for dual touch is converted to coordinates by the host processor by processing the data which the BU21029GUL outputs. the data outputted changes with the commands received from the host processor as shown in table1. the host processor should take data from the BU21029GUL by burst read via i2c. when reception stops and resumes before all data is taken, data is again outputted from byte0. when using only single point detection, it may be the end of reception once each coordinate is taken. table 9. the output data list of each command 0 1 2 3 4 5 6- - - 7- - - 8- - - 9- - - 10 - - - 11 - - - 12 - - - 13 - - - 14 - - - 15 - - - ghost parameter dummy dummy dummy z1 coordinate z2 coordinate x 2 points paramter y 2 points paramter ghost parameter x coordinate x 2 points paramter y coordinate y 2 points paramter z2 coordinate z1 coordinate x coordinate y coordinate table 10. the output data format list bit07 bit06 bit05 bit04 bit03 bit02 bit01 bit00 bit07 bit06 bit05 bit04 bit03 bit02 bit01 bit00 x coordinatex[11]x[10]x[9]x[8]x[7]x[6]x[5]x[4]x[3]x[2]x[1]x[0]0000 y coordinatey[11]y[10]y[9]y[8]y[7]y[6]y[5]y[4]y[3]y[2]y[1]y[0]0000 z1 coordinatez1[11]z1[10]z1[9]z1[8]z1[7]z1[6]z1[5]z1[4]z1[3]z1[2]z1[1]z1[0]0000 z2 coordinatez2[11]z2[10]z2[9]z2[8]z2[7]z2[6]z2[5]z2[4]z2[3]z2[2]z2[1]z2[0]0000 x 2 points p aramete r px[9]px[8]px[7]px[6]px[5]px[4]px[3]px[2]px[1]px[0]00000spx y 2 points p aramete r py[9]py[8]py[7]py[6]py[5]py[4]py[3]py[2]py[1]py[0]00000spy ghost p aramete r gh[11] gh[10] gh[9] gh[8] gh[7] gh[6] gh[5] gh[4] gh[3] gh[2] gh[1] gh[0] 0 0 0 sgh byteh bytel data (*1)the byteh is the even number byte. the bytel is the odd number byte. it means that x coordinates are byteh=byte0 and bytel=byte1 when it is taken with a command method. x coordinate: touched coordinate of x. it becomes gravity center coordinate of 2 points at dual touch. x = byteh * 16 + bytel / 16 y coordinate: touched coordinate of y. it becomes gravity center coordinate of 2 points at dual touch. y = byteh * 16 + bytel / 16 z1 coordinate: touched coordinate of z1. it?s used in calculating touch pressure. z1 = byteh * 16 + bytel / 16 z2 coordinate: touched coordinate of z2. it?s used in calculating touch pressure. z2 = byteh * 16 + bytel / 16 x 2-point touch parameter: it is used for 2-point touch detection. it serves as pointer of the lock up table used for x-axis 2-point distance calculation. px may be set to 0 when spx is 1because the x-axis 2-point distance becomes 0. px = byteh * 4 + bytel / 64 (in the case of spx=0) px = (byteh * 4 + bytel / 64) - 1024(in the case of spx=1.) y 2-point touch parameter: it is used for 2-point touch detection. it serves as pointer of the lock up table used for y-axis 2-point distance calculation. py may be set to 0 when spy is 1 because the y-axis 2-point distance becomes 0. py = byteh * 4 + bytel / 64 (in the case of spy=0) py = (byteh * 4 + bytel / 64) - 1024(in the case of spy=1) ghost parameter: it is a value for judging a touch position (the direction of inclination) at dual touch. gh = byteh * 16 + bytel / 16 (in the case of sgh=0) gh = (byteh * 16 + bytel / 16) - 4096(in the case of sgh=1)
17/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 11. 2-point touch coordinate conversion flow step operation 1 all the data is acquired and converted according to the procedure in p.16. 2 if required, a filter etc. will be processng the data. 3 if there is only 1-point touch detection, conversion ends. 4 2-point touch detection: 2-point touch is detected by comparing px py and gh with a threshold. if 2- p oint touch is not detected , conversion ends. 5 x-axis 2-point distance calculation 1: data is acquired from the distance conv ersion table using the maximum of 2 points distance (pxmax) determined beforehand. the data is set to prmx1. 6 x-axis 2-point distance calculation 2: data is acquired from the dis tance conversion table using px. the data is set to prmx2. 7 x-axis 2-point distance calculation 3: the 2-point distance x-axis (dx) calculated. dx = 2048 * ( prmx2 / prmx1 ) 8 y-axis 2-point distance calculation 1: data is acquired from the distance conv ersion table using the maximum of 2 points distance (pymax) determined beforehand. the data is set to prmy1. 9 y-axis 2-point distance calculation 2: data is acquired from the dis tance conversion table using py. the data is set to prmy2. 10 y-axis 2-point distance calculation 3: the 2-point distance of y-axis (dy) calculated. dy = 2048 * ( prmy2 / prmy1 ) 11 x -ax i s 2 -po i n t t ouc h coor di na t e convers i on: x-axis 2-point touch coordinate is converted from center position(x) and distance(dx). x1 = x + dx x2 = x - dx 12 y - axis 2 - point touch coordinate conversion: y-axis 2-point touch coordinate is convert ed from center position(y), distance(dy) and ghost value(gh). when gh is greater than threshold. y1 = y + dy y2 = y - dy when gh is less than threshold. y1 = y - dy y2 = y + dy 13 2-point coordinate is generated and since they are not exact coordinates, i f 2-point coordinates are required, they process offset etc. 14 conversion is ends. (*1)pxmax is the value of px when touching both ends of x-axis on touch screen. (*2)pymax is the value of py when touching both ends of x-axis on touch screen. (*3)a coordinate is set to 4095 if it becomes over 4095 and to 0, if it becomes below 0.
18/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 register description table 12. cfr0 register (page=0, addr=0x0, reset value=0x20) d7 d6 d5 d4 d3 d2 d1 d0 rsv0 rsv0 calib intrm rsv0 rsv0 rsv0 rsv0 bits d7-d6, d3-d0: rsv0 reserved. set these bits to 0. bit d5 : calib internal parameter setting-1 for calibration of dual touch detection 0= not to use calibration result 1= use calibration result bit d4 : intrm setting of int state in case BU21029GUL is active after conversion by ?pdm? setting 0= depend on ?pen-down? 1= always output ?0? table 13. cfr1 register (page=0, addr=0x1, reset value=0xa6) d7 d6 d5 d4 d3 d2 d1 d0 mav - a ve[2:0] smpl[2:0] bit d7: mav median average filter 0= off 1= on bits d6-d4: ave ave+1= the number of average samples setting for mav. if ave is greater than smpl, ave takes the value of smpl. bits d2-d0: smpl smpl+1= the number of conversion samples setting for mav. ex. in the case of cfr1 = 0xa6 (the number of average sa mples is 3 and the number of conversion samples is 7) conversion result { 1676, 1688, 1656, 1677, 1659, 1702, 4095 } sorted result { 1656, 1659, 1676, 1677, 1688, 1702, 4095 } chose 3 center data { 1656 , 1659 , 1676, 1677, 1688, 1702 , 4095 } average above 3 data = (1676 + 1677 + 1688) / 3 =1680 (vs averaged all six data = 2022)
19/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 14. cfr2 register (page=0, addr=0x2, reset value=0x04) d7 d6 d5 d4 d3 d2 d1 d0 intvl_time[3:0] time_st_adc[3:0] bits d7-d4: intvl_time this sets the waiting time between completion of conversion and start of next conversion. (only usable setting at conversion function=0x0.) if used, set value as four or more. table 15. intvl_time setting value time 0x0 0x3 reserved 0x4 0.256ms 0x5 1.024ms 0x6 2.048ms 0x7 4.096ms 0x8 5.120ms 0x9 8.912ms 0xa 10.240ms 0xb 15.360ms 0xc 0xf 20.480ms times shown above are calculated with oscillating frequency of internal osc at 8mhz. bit d3-d0 : time_st_adc this sets the waiting time between application of voltage to panel and start of a/d conversion. table 16. time_st_adc setting value time 0x0 10us 0x1 20us 0x2 30us 0x3 40us 0x4 50us 0x5 60us 0x6 70us 0x7 80us 0x8 90us 0x9 100us 0xa 200us 0xb 250us 0xc 300us 0xd 350us 0xe 400us 0xf 450us times shown above are calculated with oscillating frequency of internal osc at 8mhz.
20/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 17. evr register (page=0, addr=0x3 to 0x5, reset value=0x10) d7 d6 d5 d4 d3 d2 d1 d0 evr_*[7:0] bits d7-d0: evr_* this is gain setting 1 for dual touch detection. when using 2-poi nt detection function, it is necessary to set this before conversion. it corresponds to x, y and xy (z). it is not necessary to change evr_xy from initial value. table 18. pimir register (page=0, addr=0x9 to 0xa, reset value=0x0f) d7 d6 d5 d4 d3 d2 d1 d0 - - - pimir_*[4:0] bits d4-d0: pimir_* this is gain setting 2 for dual touch detection. it is not necessary to change this from the initial value. it corresponds to x and y. table 19. cfr3 register (page=0, addr=0xb, reset value=0x72) d7 d6 d5 d4 d3 d2 d1 d0 rm8 stretch pu90k dual pidac_ofs[3:0] bit d7: rm8 coordinate resolution setting 0= 12bit 1= 8bit bit d6: stretch scl_stretch function setting 0= off 1= on bit d5 : pu90k internal pull-up resistance for touch detection setting 0 = about 50k ? 1= about 90k ? bit d4: dual dual touch detection function setting 0= off 1= on bits d3-d0: pidac_ofs dual touch detection circuit adjustment setting. it is not necessary to change this from initial value. table 20. ldo register (page=0, addr=0xc, reset value=0x00) d7 d6 d5 d4 d3 d2 d1 d0 -- pvdd[2:0] avdd[2:0] bits d6-d4: pvdd regulator for panel output setting. by increasing voltage, influence of exogenous noise from the panel interface is reduced. table 21. pvdd setting value output 01.500v 11.556v 21.615v 31.680v 41.750v 51.826v 61.909v 72.000v bits d2-d0: avdd the output voltage setting of the analog circuit regulator the relationship of setting value and output voltage is same as pvdd. it is not possible to change from the initial value when vdd or pvdd is lower than 2.5v.
21/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 22. status register (page=0, addr=0xd, reset value=0x00, read only) d7 d6 d5 d4 d3 d2 d1 d0 test auto pdm - busy active calib _done touch bit d7: test this bit will become ?1? during test mode. bit d6: auto this bit will become ?1? at conversion function 0. bit d5: pdm pdm setting value of command byte1 bit d3: busy this bit will become ?1? during conversion of 1 st coordinate data. bit d2: active this bit will become ?1? when internal analog circuit is active. bit d1: calib_done this bit will become ?1? in case that dual touch detection parameter adjustment is finished by command (cf=0x5). this bit will be clear when ?1? is written on this bit. bit d0: touch this bit will become ?1? when pen-down is internally detected. table 23. hw_id1 register (page=0, addr=0xe, reset value=0x02, read only) d7 d6 d5 d4 d3 d2 d1 d0 hw_idh bits d7-d0: hw_idh high 8bit of ic?s id table 24. hw_id2 register (page=0, addr=0xf, reset value=0x29, read only) d7 d6 d5 d4 d3 d2 d1 d0 hw_idl bits d7-d0: hw_idl low 8-bit of ic?s id table 25. free_sw1 register (page=1, addr=0x0, reset value=0x00) d7 d6 d5 d4 d3 d2 d1 d0 sw_yp_ pow sw_yp_ gnd sw_yn_ pow sw_yn_ gnd sw_xp_ pow sw_xp_ gnd sw_xn_ pow sw_xn_ gnd bits d7-d0: sw_**_pow(gnd) driver setting at conversion function 4(free scan) drive to ?+? by set pow and ?-?by set gnd, must not set ?+?and?-?to one terminal at the same time. ** = the corresponding terminal name
22/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 table 26. free_sw2 register (page=1, addr=0x1, reset value=0x00) d7 d6 d5 d4 d3 d2 d1 d0 rsv0 rsv0 rsv0 sw_aux sw_ypm sw_ynm sw_xpm sw_xnm bits d7 ? d5: rsv0 reserved. they must be set ?0?. bit d4: sw_aux bit d3-d0: sw_**m a/d input setting at conversion function 4(free scan) ** = the corresponding terminal name table 27. spcfg (page=1, addr=0x5, reset value=0x03) d7 d6 d5 d4 d3 d2 d1 d0 rsv0 dprm rsv0 rsv0 rsv0 rsv0 rsv1 rsv1 bits d7, d5-d2 : rsv0 , bits d1-d0 : rsv1 rsv0 must be set to 0 and rsv1 must be set to 0 bit d6: dprm 2-point touch parameter through mode 0=off (normal) 1=on (through for test).
23/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding input pins of the ic in the construction of this ic, p-n junctions are inevitably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this ic.
24/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the cha nge of c apacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. others if this lsi will be used, please read other detailed documents such as functional description and application note.
25/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 ordering information physical dimension tape and reel information marking diagram u 0 2 9 1 pin mark lot no. b u 2 1 0 2 9 g u l - e 2 part number package gul: vcsp50l2 packaging and forming specification e2: embossed tape and reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin
26/26 datasheet datasheet BU21029GUL tsz02201-0y1y0f300120-1-2 ? 2011 rohm co., ltd. all rights reserved. 11.nov.2013 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 ?s date revision changes 11.nov.2013 002 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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